Course catalog description: Overview of microelectronic processing technology, including lithography, etching, oxidation, diffusion, implantation and annealing, film deposition, epitaxy growth, metallization, process integration and simulation. Conduct the basic microelectronic fabrication experiments in the lab.
Credits and contact hours: 3 credits; 1 hour and 20-minute session twice a week, every week
Pre-Requisite courses: 14:332:361
Co-Requisite courses: None
Topics Covered:
- Overview of Microelectronic Processing: Semiconductor Materials, Basic FET and BJT device structures, Safety in the cleanroom facility, SUPREM simulation tool
- Lithography and Etching: Photolithographic process, Photomask design and fabrication
- Thermal Oxidation: Physical Model and Process, Laboratory Project – Photolithography
- Thermal Oxidation: Selective Oxidation, Masking properties of SiO2, Simulation techniques
- Thermal Oxidation: Characterization, Laboratory Project – Oxidation
- Diffusion: Physical Models, Constant source diffusion, Limited source diffusion
- Diffusion: Process, Two-step diffusion, Successive diffusion, Solid-solubility
- Junction Formation and Characterization: Vertical and lateral diffusion, Process simulation, Laboratory Project – Diffusion
- Ion Implantation and Annealing: Physical Models
- Ion Implantation: Channeling, Furnace annealing, Rapid thermal annealing
- Ion Implantation: Simulation and Characterization, Laboratory Project – pn diodes
- Metallization Technology: Schottky contacts, Ohmic contacts
- Process Integration: Physical Model, Laboratory Project – Device Processing: Design and Simulation
- Process Integration: Characterization
Textbook: Jaeger, Introduction to Microelectronic Fabrication, Prentice Hall; S. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press.