Course Catalog Description: 14:332:467 Microelectronic Processing (3)
Overview of microelectronic processing technology, including lithography, etching, oxidation, diffusion, implantation and annealing, film deposition, epitaxy growth, metallization, process integration and simulation. Conduct the basic microelectronic fabrication experiments in the lab.
1. An ability to understand the principles of the basic microelectronic processing technology.
2. An ability to implement the basic methodologies of lithography, etching, oxidation, diffusion, implantation and annealing, film deposition, epitaxy growth, metallization, etc, process and the process integration.
3. An ability to present technical concepts and experimental results in the lab reports.
- Homework and Class Participation (15%)
- Laboratory Reports (30%)
- Exams (55%)
N = none S = Supportive H = highly related
Outcome |
Level |
Proficiency assessed by |
(a) an ability to apply knowledge of Mathematics, science, and engineering |
H |
Homeworks, Lab reports, Final Exam |
(b) an ability to design and conduct experiments and interpret data |
H |
Lab Projects |
(c) an ability to design a system, component or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability |
S |
Lab Projects |
(d) an ability to function as part of a multi-disciplinary team |
S |
Lab Projects, Lab Reports. |
(e) an ability to identify, formulate, and solve ECE problems |
H |
Homework Problems, Lab projects |
(f) an understanding of professional and ethical responsibility |
S |
Laboratory exercises |
(g) an ability to communicate in written and oral form |
H |
Lab Reports, Presentations |
(h) the broad education necessary to understand the impact of electrical and computer engineering solutions in a global, economic, environmental, and societal context |
N |
|
(i) a recognition of the need for, and an ability to engage in life-long learning |
S |
Lectures, Homeworks, Lab Exercises |
(j) a knowledge of contemporary issues |
N |
|
(k) an ability to use the techniques, skills, and modern engineering tools necessary for electrical and computer engineering practice |
H |
Lectures, Homeworks, Lab projects |
Basic disciplines in Electrical Engineering |
H |
Lectures, homeworks, Lab projects |
Depth in Electrical Engineering |
S |
Lectures, Homeworks, Lab projects |
Basic disciplines in Computer Engineering |
S |
Computer-aided process simulation |
Depth in Computer Engineering |
N |
|
Laboratory equipment and software tools |
H |
Lab Projects, process simulation |
Variety of instruction formats |
S |
Lectures, Labs, Office Hours |
Week 1: Overview of Microelectronic Processing: Semiconductor Materials, Basic FET and BJT device structures, Safety in the cleanroom facility, SUPREM simulation tool
Week 2: Lithography and Etching: Photolithographic process, Photomask design and fabrication
Week 3: Thermal Oxidation: Physical Model and Process, Laboratory Project - Photolithography
Week 4: Thermal Oxidation: Selective Oxidation, Masking properties of SiO2, Simulation techniques
Week 5: Thermal Oxidation: Characterization, Laboratory Project - Oxidation
Week 6: Diffusion: Physical Models, Constant source diffusion, Limited source diffusion
Week 7: Diffusion: Process, Two-step diffusion, Successive diffusion, Solid-solubility
Week 8: Junction Formation and Characterization: Vertical and lateral diffusion, Process simulation, Laboratory Project - Diffusion
Week 9: Ion Implantation and Annealing: Physical Models
Week 10: Ion Implantation: Channeling, Furnace annealing, Rapid thermal annealing
Week 11: Ion Implantation: Simulation and Characterization, Laboratory Project – pn diodes
Week 12: Metallization Technology: Schottky contacts, Ohmic contacts
Week 13: Process Integration: Physical Model, Laboratory Project – Device Processing: Design and Simulation
Week 14: Process Integration: Characterization
Week 15: Review
Week 16: Final Examination
2. Use of available technical resources (library, corporate publications, Internet).
3. Conduct the experiments on microfabrications in lab.
4. Conduct the simulations to design and evaluate the process.
5. Technical writing – Present and discuss the results for laboratory experiments.
(b) Engineering Topics (Science and/or Design): 3 credit hours
(c) General Education: 0 credit hours
Total credits: 3