ECE Colloquium - March 11
Dr. William Arnold
Chief Scientist and Vice President of Technology Development Center
CoRE Building Lecture Hall
Lithography is used to pattern semiconductor devices such as memories and processors. Water immersion lithography using the ArF excimer laser source at 193nm is the key manufacturing tool today. EUV lithography is developed to continue the shrink of integrated circuit features below 20nm half pitch.
Laser produced plasma sources operating at 13.5nm are used with all-reflective optics to expose resists. This presentation will describe the status of EUVL and the remaining challenges to bring it into high volume manufacturing by 2015.
Bill Arnold is for 15 years the chief scientist of ASML, the world's leading supplier of lithography equipment for semiconductor manufacturing. He is also Sr. Vice President of the ASML Technology Development Center. Before that he was 18 years with Advanced Micro Devices, a leading manufacturer of microprocessors. He had many jobs over time at AMD, the last being Director of Advanced Process Development and Sr. Fellow. In 2013, Mr. Arnold is the President of SPIE, the International Society for Optics and Photonics.