14:332:467 Microelectronic Processing

Course Catalog Description: 

14:332:467 Microelectronic Processing (3)
Overview of microelectronic processing technology, including lithography, etching, oxidation, diffusion, implantation and annealing, film deposition, epitaxy growth, metallization, process integration and simulation. Conduct the basic microelectronic fabrication experiments in the lab.

Pre-Requisite Courses: 


Pre-Requisite by Topic: 

Electronic Devices

Textbook & Materials: 

Jaeger, Introduction to Microelectronic Fabrication, 2nd Ed, Prentice Hall, 2002.

S. Campbell, The Science and Engineering of Microelectronic Fabrication, 2nd Ed., Oxford University Press, 2001.


Laboratory Manuals

Overall Educational Objective: 

To introduce basic principles governing microelectronic processing technology.

Course Learning Outcomes: 

A student who successfully fulfills the course requirements will have demonstrated:
1. An ability to understand the principles of the basic microelectronic processing technology.
2. An ability to implement the basic methodologies of lithography, etching, oxidation, diffusion, implantation and annealing, film deposition, epitaxy growth, metallization, etc, process and the process integration.
3. An ability to present technical concepts and experimental results in the lab reports.

How Course Outcomes are Assessed: 

  • Homework and Class Participation (15%)
  • Laboratory Reports (30%)
  • Exams (55%)

N = none S = Supportive H = highly related



Proficiency assessed by

(a) an ability to apply knowledge of Mathematics, science, and engineering


Homeworks, Lab reports, Final Exam

(b) an ability to design and conduct experiments and interpret data


Lab Projects

(c) an ability to design a system, component or process to meet desired needs within realistic constraints such as economic, environmental, social, political, ethical, health and safety, manufacturability, and sustainability


Lab Projects

(d) an ability to function as part of a multi-disciplinary team


Lab Projects, Lab Reports.

(e) an ability to identify, formulate, and solve ECE problems


Homework Problems, Lab projects

(f) an understanding of professional and ethical responsibility


Laboratory exercises

(g) an ability to communicate in written and oral form


Lab Reports, Presentations

(h) the broad education necessary to understand the impact of electrical and computer engineering solutions in a global, economic, environmental, and societal context


(i) a recognition of the need for, and an ability to engage in life-long learning


Lectures, Homeworks, Lab Exercises

(j) a knowledge of contemporary issues


(k) an ability to use the techniques, skills, and modern engineering tools necessary for electrical and computer engineering practice


Lectures, Homeworks, Lab projects

Basic disciplines in Electrical Engineering


Lectures, homeworks, Lab projects

Depth in Electrical Engineering


Lectures, Homeworks, Lab projects

Basic disciplines in Computer Engineering


Computer-aided process simulation

Depth in Computer Engineering


Laboratory equipment and software tools


Lab Projects, process simulation

Variety of instruction formats


Lectures, Labs, Office Hours

Topics Covered week by week: 

Week 1: Overview of Microelectronic Processing: Semiconductor Materials, Basic FET and BJT device structures, Safety in the cleanroom facility, SUPREM simulation tool
Week 2: Lithography and Etching: Photolithographic process, Photomask design and fabrication
Week 3: Thermal Oxidation: Physical Model and Process, Laboratory Project - Photolithography
Week 4: Thermal Oxidation: Selective Oxidation, Masking properties of SiO2, Simulation techniques
Week 5: Thermal Oxidation: Characterization, Laboratory Project - Oxidation
Week 6: Diffusion: Physical Models, Constant source diffusion, Limited source diffusion
Week 7: Diffusion: Process, Two-step diffusion, Successive diffusion, Solid-solubility
Week 8: Junction Formation and Characterization: Vertical and lateral diffusion, Process simulation, Laboratory Project - Diffusion
Week 9: Ion Implantation and Annealing: Physical Models
Week 10: Ion Implantation: Channeling, Furnace annealing, Rapid thermal annealing
Week 11: Ion Implantation: Simulation and Characterization, Laboratory Project – pn diodes
Week 12: Metallization Technology: Schottky contacts, Ohmic contacts
Week 13: Process Integration: Physical Model, Laboratory Project – Device Processing: Design and Simulation
Week 14: Process Integration: Characterization
Week 15: Review
Week 16: Final Examination

Computer Usage: 

Simulations are conducted using CAD software packages.

Laboratory Experiences: 

Extensive laboratory experiences using, in part, the equipment in the Microelectronics Research Laboratory (MERL).

Design Experiences: 

Moderate design experience related to microelectronic processing

Independent Learning Experiences : 

1. Homework problems.
2. Use of available technical resources (library, corporate publications, Internet).
3. Conduct the experiments on microfabrications in lab.
4. Conduct the simulations to design and evaluate the process.
5. Technical writing – Present and discuss the results for laboratory experiments.

Contribution to the Professional Component: 

(a) College-level mathematics and basic sciences: 0 credit hours
(b) Engineering Topics (Science and/or Design): 3 credit hours
(c) General Education: 0 credit hours
Total credits: 3

Prepared by: 
Yicheng Lu, Hussein Hanafi
April, 2011